Polarization Behaviors of SnCu Pb-Free Solder Depending on the P, Ni, Addition
نویسندگان
چکیده
منابع مشابه
FRAGILITY OF Pb-FREE SOLDER JOINTS
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
متن کاملFragility of Pb-free Solder Joints
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
متن کاملEffects of solder volume on formation and redeposition of Au- containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints
SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...
متن کاملEffects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints
SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Ni/Au-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...
متن کاملCreep Behavior of a Sn-Ag-Bi Pb-Free Solder
Compression creep tests were performed on the ternary 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) Pb-free alloy. The test temperatures were: −25 °C, 25 °C, 75 °C, 125 °C, and 160 °C (± 0.5 °C). Four loads were used at the two lowest temperatures and five at the higher temperatures. The specimens were tested in the as-fabricated condition or after having been subjected to one of two air a...
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ژورنال
عنوان ژورنال: Korean Journal of Materials Research
سال: 2005
ISSN: 1225-0562
DOI: 10.3740/mrsk.2005.15.8.528